Wednesday, December 7, 2011

Our New PCB line for HDI needs.

Hughes Cain & Associates is proud to announce our alliance with ProTech Interconnect Solutions.
Using tight process controls and the latest in LDI equipment, Protech can build with aspect ratios as high 
as 18:1 and consistently builds boards with finished lines/spaces of .0025/.003.

Process Capabilities:
  • 1 to 48 layer multilayer packages
  • MIL-PRF-55110/Mil-31032 certified (Polyimide and FR4)
  • Controlled impedance modeling down to 15 ohm
  • High performance materials & specialty dielectrics
  • RF, Microwave, hi-speed digital and hybrid solutions
  • ROHS compliant material options
  • UL approved for heavy copper, 5 oz. inners, 6 oz. outers
  • Specialty power products up to 10 ounce outer layer copper
  • Embedded capacitance
Give us a call today or log onto www.protech.com for a quick quote and fast turn.